1D to 3D Coupling of an Infinitesimal Width Moving Laser on a Silicon Substrate

Abstract

Micromechanical components such as acceleration sen-sors in car safety systems and micro-fluidic circuits are normally made of monocrystalline silicon. The modeling of laser microma-chining of complex shapes using silicon still remains a vital area of research. This paper explores the current status of research and developments of 3D modeling techniques for laser micromachining of silicon substrate. It covers a brief insight of the laser propagation and absorption as well as the resulting material heat responses. This paper further presents the model to implement the heat sources motion when coupling a 3D temperature variable, T , to a 1D equation. The subdomain extrusion coupling variable using a general transformation has also been analyzed. The method for using a separate geometry and equation to model the source term is presented. This is very useful because it provides that term directly at the test-function level.